dts: update to v5.9-rc1

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>

19 files changed, 163 insertions, 702 deletions

diff --git a/dts/Bindings/thermal/allwinner,sun8i-a83t-ths.yaml b/dts/Bindings/thermal/allwinner,sun8i-a83t-ths.yaml
index 87369264fe..44ba676569 100644
--- a/dts/Bindings/thermal/allwinner,sun8i-a83t-ths.yaml
+++ b/dts/Bindings/thermal/allwinner,sun8i-a83t-ths.yaml
@@ -50,7 +50,7 @@ properties:
   nvmem-cell-names:
     const: calibration
 
-  # See ./thermal.txt for details
+  # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
   "#thermal-sensor-cells":
     enum:
       - 0
diff --git a/dts/Bindings/thermal/amazon,al-thermal.txt b/dts/Bindings/thermal/amazon,al-thermal.txt
index 703979dbd5..12fc4ef048 100644
--- a/dts/Bindings/thermal/amazon,al-thermal.txt
+++ b/dts/Bindings/thermal/amazon,al-thermal.txt
@@ -6,7 +6,7 @@ transaction.
 Required properties:
 - compatible: "amazon,al-thermal".
 - reg: The physical base address and length of the sensor's registers.
-- #thermal-sensor-cells: Must be 1. See ./thermal.txt for a description.
+- #thermal-sensor-cells: Must be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
 
 Example:
 	thermal: thermal {
diff --git a/dts/Bindings/thermal/brcm,avs-ro-thermal.yaml b/dts/Bindings/thermal/brcm,avs-ro-thermal.yaml
index f3e68ed03a..1ab5070c75 100644
--- a/dts/Bindings/thermal/brcm,avs-ro-thermal.yaml
+++ b/dts/Bindings/thermal/brcm,avs-ro-thermal.yaml
@@ -23,7 +23,7 @@ properties:
   compatible:
     const: brcm,bcm2711-thermal
 
-  # See ./thermal.txt for details
+  # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
   "#thermal-sensor-cells":
     const: 0
 
diff --git a/dts/Bindings/thermal/brcm,bcm2835-thermal.txt b/dts/Bindings/thermal/brcm,bcm2835-thermal.txt
index da8c5b73ad..a3e9ec5dc7 100644
--- a/dts/Bindings/thermal/brcm,bcm2835-thermal.txt
+++ b/dts/Bindings/thermal/brcm,bcm2835-thermal.txt
@@ -7,7 +7,7 @@ compatible: 		should be one of: "brcm,bcm2835-thermal",
 			"brcm,bcm2836-thermal" or "brcm,bcm2837-thermal"
 reg:			Address range of the thermal registers.
 clocks: 		Phandle of the clock used by the thermal sensor.
-#thermal-sensor-cells:	should be 0 (see thermal.txt)
+#thermal-sensor-cells:	should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
 
 Example:
 
diff --git a/dts/Bindings/thermal/hisilicon-thermal.txt b/dts/Bindings/thermal/hisilicon-thermal.txt
index cef716a236..4b19d80e65 100644
--- a/dts/Bindings/thermal/hisilicon-thermal.txt
+++ b/dts/Bindings/thermal/hisilicon-thermal.txt
@@ -9,7 +9,7 @@
   by /SOCTHERM/tsensor.
 - clock-names: Input clock name, should be 'thermal_clk'.
 - clocks: phandles for clock specified in "clock-names" property.
-- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
 
 Example :
 
diff --git a/dts/Bindings/thermal/max77620_thermal.txt b/dts/Bindings/thermal/max77620_thermal.txt
index 323a3b3822..82ed5d4879 100644
--- a/dts/Bindings/thermal/max77620_thermal.txt
+++ b/dts/Bindings/thermal/max77620_thermal.txt
@@ -8,12 +8,12 @@ below threshold level.
 
 Required properties:
 -------------------
-#thermal-sensor-cells:	Please refer <devicetree/bindings/thermal/thermal.txt>
-			for more details.
+#thermal-sensor-cells:	For more details, please refer to
+			<devicetree/bindings/thermal/thermal-sensor.yaml>
 			The value must be 0.
 
 For more details, please refer generic thermal DT binding document
-<devicetree/bindings/thermal/thermal.txt>.
+<devicetree/bindings/thermal/thermal*.yaml>.
 
 Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding
 document for the MAX77620.
diff --git a/dts/Bindings/thermal/mediatek-thermal.txt b/dts/Bindings/thermal/mediatek-thermal.txt
index f8d7831f39..1e249c42fa 100644
--- a/dts/Bindings/thermal/mediatek-thermal.txt
+++ b/dts/Bindings/thermal/mediatek-thermal.txt
@@ -23,7 +23,7 @@ Required properties:
 - resets: Reference to the reset controller controlling the thermal controller.
 - mediatek,auxadc: A phandle to the AUXADC which the thermal controller uses
 - mediatek,apmixedsys: A phandle to the APMIXEDSYS controller.
-- #thermal-sensor-cells : Should be 0. See ./thermal.txt for a description.
+- #thermal-sensor-cells : Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
 
 Optional properties:
 - nvmem-cells: A phandle to the calibration data provided by a nvmem device. If
diff --git a/dts/Bindings/thermal/nvidia,tegra124-soctherm.txt b/dts/Bindings/thermal/nvidia,tegra124-soctherm.txt
index f02f38527a..db880e7ed7 100644
--- a/dts/Bindings/thermal/nvidia,tegra124-soctherm.txt
+++ b/dts/Bindings/thermal/nvidia,tegra124-soctherm.txt
@@ -28,9 +28,10 @@ Required properties :
   See ../reset/reset.txt for details.
 - reset-names : Must include the following entries:
   - soctherm
-- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description
-    of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a
-    list of valid values when referring to thermal sensors.
+- #thermal-sensor-cells : Should be 1. For a description of this property, see
+     Documentation/devicetree/bindings/thermal/thermal-sensor.yaml.
+    See <dt-bindings/thermal/tegra124-soctherm.h> for a list of valid values
+    when referring to thermal sensors.
 - throttle-cfgs: A sub-node which is a container of configuration for each
     hardware throttle events. These events can be set as cooling devices.
   * throttle events: Sub-nodes must be named as "light" or "heavy".
@@ -62,7 +63,8 @@ Required properties :
         TEGRA_SOCTHERM_THROT_LEVEL_MED (75%),
         TEGRA_SOCTHERM_THROT_LEVEL_HIGH (85%).
       - #cooling-cells: Should be 1. This cooling device only support on/off state.
-        See ./thermal.txt for a description of this property.
+        For a description of this property see:
+	Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
 
       Optional properties: The following properties are T210 specific and
       valid only for OCx throttle events.
diff --git a/dts/Bindings/thermal/nvidia,tegra186-bpmp-thermal.txt b/dts/Bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
index e17c07be27..fc87f6aa1b 100644
--- a/dts/Bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
+++ b/dts/Bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
@@ -8,7 +8,7 @@ exposed by BPMP.
 The BPMP thermal node must be located directly inside the main BPMP node. See
 ../firmware/nvidia,tegra186-bpmp.txt for details of the BPMP binding.
 
-This node represents a thermal sensor. See thermal.txt for details of the
+This node represents a thermal sensor. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details of the
 core thermal binding.
 
 Required properties:
diff --git a/dts/Bindings/thermal/qcom-spmi-temp-alarm.txt b/dts/Bindings/thermal/qcom-spmi-temp-alarm.txt
index 0273a92a2a..2d5b2ad033 100644
--- a/dts/Bindings/thermal/qcom-spmi-temp-alarm.txt
+++ b/dts/Bindings/thermal/qcom-spmi-temp-alarm.txt
@@ -8,7 +8,7 @@ Required properties:
 - compatible:      Should contain "qcom,spmi-temp-alarm".
 - reg:             Specifies the SPMI address.
 - interrupts:      PMIC temperature alarm interrupt.
-- #thermal-sensor-cells: Should be 0. See thermal.txt for a description.
+- #thermal-sensor-cells: Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
 
 Optional properties:
 - io-channels:     Should contain IIO channel specifier for the ADC channel,
diff --git a/dts/Bindings/thermal/qcom-tsens.yaml b/dts/Bindings/thermal/qcom-tsens.yaml
index d7be931b42..95462e071a 100644
--- a/dts/Bindings/thermal/qcom-tsens.yaml
+++ b/dts/Bindings/thermal/qcom-tsens.yaml
@@ -8,7 +8,7 @@ $schema: http://devicetree.org/meta-schemas/core.yaml#
 title: QCOM SoC Temperature Sensor (TSENS)
 
 maintainers:
-  - Amit Kucheria <amit.kucheria@linaro.org>
+  - Amit Kucheria <amitk@kernel.org>
 
 description: |
   QCOM SoCs have TSENS IP to allow temperature measurement. There are currently
@@ -23,6 +23,7 @@ properties:
         items:
           - enum:
               - qcom,msm8916-tsens
+              - qcom,msm8939-tsens
               - qcom,msm8974-tsens
           - const: qcom,tsens-v0_1
 
@@ -40,6 +41,8 @@ properties:
               - qcom,msm8998-tsens
               - qcom,sc7180-tsens
               - qcom,sdm845-tsens
+              - qcom,sm8150-tsens
+              - qcom,sm8250-tsens
           - const: qcom,tsens-v2
 
   reg:
diff --git a/dts/Bindings/thermal/qoriq-thermal.txt b/dts/Bindings/thermal/qoriq-thermal.txt
deleted file mode 100644
index 28f2cbaf17..0000000000
--- a/dts/Bindings/thermal/qoriq-thermal.txt
+++ /dev/null
@@ -1,71 +0,0 @@
-* Thermal Monitoring Unit (TMU) on Freescale QorIQ SoCs
-
-Required properties:
-- compatible : Must include "fsl,qoriq-tmu" or "fsl,imx8mq-tmu". The
-	version of the device is determined by the TMU IP Block Revision
-	Register (IPBRR0) at offset 0x0BF8.
-	Table of correspondences between IPBRR0 values and example  chips:
-		Value           Device
-		----------      -----
-		0x01900102      T1040
-- reg : Address range of TMU registers.
-- interrupts : Contains the interrupt for TMU.
-- fsl,tmu-range : The values to be programmed into TTRnCR, as specified by
-	the SoC reference manual. The first cell is TTR0CR, the second is
-	TTR1CR, etc.
-- fsl,tmu-calibration : A list of cell pairs containing temperature
-	calibration data, as specified by the SoC reference manual.
-	The first cell of each pair is the value to be written to TTCFGR,
-	and the second is the value to be written to TSCFGR.
-- #thermal-sensor-cells : Must be 1. The sensor specifier is the monitoring
-	site ID, and represents the "n" in TRITSRn and TRATSRn.
-
-Optional property:
-- little-endian : If present, the TMU registers are little endian. If absent,
-	the default is big endian.
-- clocks : the clock for clocking the TMU silicon.
-
-Example:
-
-tmu@f0000 {
-	compatible = "fsl,qoriq-tmu";
-	reg = <0xf0000 0x1000>;
-	interrupts = <18 2 0 0>;
-	fsl,tmu-range = <0x000a0000 0x00090026 0x0008004a 0x0001006a>;
-	fsl,tmu-calibration = <0x00000000 0x00000025
-			       0x00000001 0x00000028
-			       0x00000002 0x0000002d
-			       0x00000003 0x00000031
-			       0x00000004 0x00000036
-			       0x00000005 0x0000003a
-			       0x00000006 0x00000040
-			       0x00000007 0x00000044
-			       0x00000008 0x0000004a
-			       0x00000009 0x0000004f
-			       0x0000000a 0x00000054
-
-			       0x00010000 0x0000000d
-			       0x00010001 0x00000013
-			       0x00010002 0x00000019
-			       0x00010003 0x0000001f
-			       0x00010004 0x00000025
-			       0x00010005 0x0000002d
-			       0x00010006 0x00000033
-			       0x00010007 0x00000043
-			       0x00010008 0x0000004b
-			       0x00010009 0x00000053
-
-			       0x00020000 0x00000010
-			       0x00020001 0x00000017
-			       0x00020002 0x0000001f
-			       0x00020003 0x00000029
-			       0x00020004 0x00000031
-			       0x00020005 0x0000003c
-			       0x00020006 0x00000042
-			       0x00020007 0x0000004d
-			       0x00020008 0x00000056
-
-			       0x00030000 0x00000012
-			       0x00030001 0x0000001d>;
-	#thermal-sensor-cells = <1>;
-};
diff --git a/dts/Bindings/thermal/qoriq-thermal.yaml b/dts/Bindings/thermal/qoriq-thermal.yaml
new file mode 100644
index 0000000000..f09e8723ca
--- /dev/null
+++ b/dts/Bindings/thermal/qoriq-thermal.yaml
@@ -0,0 +1,114 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/qoriq-thermal.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal Monitoring Unit (TMU) on Freescale QorIQ SoCs
+
+maintainers:
+  - Anson Huang <Anson.Huang@nxp.com>
+
+properties:
+  compatible:
+    description: |
+      The version of the device is determined by the TMU IP Block Revision
+      Register (IPBRR0) at offset 0x0BF8.
+      Table of correspondences between IPBRR0 values and example chips:
+            Value           Device
+            ----------      -----
+            0x01900102      T1040
+    enum:
+      - fsl,qoriq-tmu
+      - fsl,imx8mq-tmu
+
+  reg:
+    maxItems: 1
+
+  interrupts:
+    maxItems: 1
+
+  fsl,tmu-range:
+    $ref: '/schemas/types.yaml#/definitions/uint32-array'
+    description: |
+      The values to be programmed into TTRnCR, as specified by the SoC
+      reference manual. The first cell is TTR0CR, the second is TTR1CR, etc.
+    maxItems: 4
+
+  fsl,tmu-calibration:
+    $ref: '/schemas/types.yaml#/definitions/uint32-matrix'
+    description: |
+      A list of cell pairs containing temperature calibration data, as
+      specified by the SoC reference manual. The first cell of each pair
+      is the value to be written to TTCFGR, and the second is the value
+      to be written to TSCFGR.
+    items:
+      items:
+        - description: value for TTCFGR
+        - description: value for TSCFGR
+    minItems: 1
+    maxItems: 64
+
+  little-endian:
+    description: |
+      boolean, if present, the TMU registers are little endian. If absent,
+      the default is big endian.
+    type: boolean
+
+  clocks:
+    maxItems: 1
+
+  "#thermal-sensor-cells":
+    const: 1
+
+required:
+  - compatible
+  - reg
+  - interrupts
+  - fsl,tmu-range
+  - fsl,tmu-calibration
+  - '#thermal-sensor-cells'
+
+additionalProperties: false
+
+examples:
+  - |
+    tmu@f0000 {
+        compatible = "fsl,qoriq-tmu";
+        reg = <0xf0000 0x1000>;
+        interrupts = <18 2 0 0>;
+        fsl,tmu-range = <0x000a0000 0x00090026 0x0008004a 0x0001006a>;
+        fsl,tmu-calibration = <0x00000000 0x00000025>,
+                              <0x00000001 0x00000028>,
+                              <0x00000002 0x0000002d>,
+                              <0x00000003 0x00000031>,
+                              <0x00000004 0x00000036>,
+                              <0x00000005 0x0000003a>,
+                              <0x00000006 0x00000040>,
+                              <0x00000007 0x00000044>,
+                              <0x00000008 0x0000004a>,
+                              <0x00000009 0x0000004f>,
+                              <0x0000000a 0x00000054>,
+                              <0x00010000 0x0000000d>,
+                              <0x00010001 0x00000013>,
+                              <0x00010002 0x00000019>,
+                              <0x00010003 0x0000001f>,
+                              <0x00010004 0x00000025>,
+                              <0x00010005 0x0000002d>,
+                              <0x00010006 0x00000033>,
+                              <0x00010007 0x00000043>,
+                              <0x00010008 0x0000004b>,
+                              <0x00010009 0x00000053>,
+                              <0x00020000 0x00000010>,
+                              <0x00020001 0x00000017>,
+                              <0x00020002 0x0000001f>,
+                              <0x00020003 0x00000029>,
+                              <0x00020004 0x00000031>,
+                              <0x00020005 0x0000003c>,
+                              <0x00020006 0x00000042>,
+                              <0x00020007 0x0000004d>,
+                              <0x00020008 0x00000056>,
+                              <0x00030000 0x00000012>,
+                              <0x00030001 0x0000001d>;
+        #thermal-sensor-cells = <1>;
+    };
diff --git a/dts/Bindings/thermal/rockchip-thermal.txt b/dts/Bindings/thermal/rockchip-thermal.txt
index c6aac9bcac..7f94669e9e 100644
--- a/dts/Bindings/thermal/rockchip-thermal.txt
+++ b/dts/Bindings/thermal/rockchip-thermal.txt
@@ -24,7 +24,7 @@ Required properties:
 - pinctrl-1 : The "default" pinctrl state, it will be set after reset the
 	      TSADC controller.
 - pinctrl-2 : The "sleep" pinctrl state, it will be in for suspend.
-- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description.
+- #thermal-sensor-cells : Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
 
 Optional properties:
 - rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value.
diff --git a/dts/Bindings/thermal/tango-thermal.txt b/dts/Bindings/thermal/tango-thermal.txt
index 212198d4b9..2c918d7428 100644
--- a/dts/Bindings/thermal/tango-thermal.txt
+++ b/dts/Bindings/thermal/tango-thermal.txt
@@ -4,7 +4,7 @@ The SMP8758 SoC includes 3 instances of this temperature sensor
 (in the CPU, video decoder, and PCIe controller).
 
 Required properties:
-- #thermal-sensor-cells: Should be 0 (see thermal.txt)
+- #thermal-sensor-cells: Should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
 - compatible: "sigma,smp8758-thermal"
 - reg: Address range of the thermal registers
 
diff --git a/dts/Bindings/thermal/thermal-cooling-devices.yaml b/dts/Bindings/thermal/thermal-cooling-devices.yaml
index 5145883d93..ad4beaf028 100644
--- a/dts/Bindings/thermal/thermal-cooling-devices.yaml
+++ b/dts/Bindings/thermal/thermal-cooling-devices.yaml
@@ -44,9 +44,9 @@ select: true
 properties:
   "#cooling-cells":
     description:
-        Must be 2, in order to specify minimum and maximum cooling state used in
-        the cooling-maps reference. The first cell is the minimum cooling state
-        and the second cell is the maximum cooling state requested.
+      Must be 2, in order to specify minimum and maximum cooling state used in
+      the cooling-maps reference. The first cell is the minimum cooling state
+      and the second cell is the maximum cooling state requested.
     const: 2
 
 examples:
diff --git a/dts/Bindings/thermal/thermal-generic-adc.txt b/dts/Bindings/thermal/thermal-generic-adc.txt
index 691a09db2f..e136946a2f 100644
--- a/dts/Bindings/thermal/thermal-generic-adc.txt
+++ b/dts/Bindings/thermal/thermal-generic-adc.txt
@@ -8,7 +8,7 @@ temperature using voltage-temperature lookup table.
 Required properties:
 ===================
 - compatible:		     Must be "generic-adc-thermal".
-- #thermal-sensor-cells:     Should be 1. See ./thermal.txt for a description
+- #thermal-sensor-cells:     Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description
 		             of this property.
 Optional properties:
 ===================
diff --git a/dts/Bindings/thermal/thermal-idle.yaml b/dts/Bindings/thermal/thermal-idle.yaml
index 7a922f5409..a832d427e9 100644
--- a/dts/Bindings/thermal/thermal-idle.yaml
+++ b/dts/Bindings/thermal/thermal-idle.yaml
@@ -18,29 +18,28 @@ description: |
   This binding describes the thermal idle node.
 
 properties:
-   $nodename:
-     const: thermal-idle
-     description: |
-        A thermal-idle node describes the idle cooling device properties to
-        cool down efficiently the attached thermal zone.
-
-   '#cooling-cells':
-      const: 2
-      description: |
-         Must be 2, in order to specify minimum and maximum cooling state used in
-         the cooling-maps reference. The first cell is the minimum cooling state
-         and the second cell is the maximum cooling state requested.
-
-   duration-us:
-      description: |
-         The idle duration in microsecond the device should cool down.
-
-   exit-latency-us:
-      description: |
-         The exit latency constraint in microsecond for the injected
-         idle state for the device. It is the latency constraint to
-         apply when selecting an idle state from among all the present
-         ones.
+  $nodename:
+    const: thermal-idle
+    description: |
+      A thermal-idle node describes the idle cooling device properties to
+      cool down efficiently the attached thermal zone.
+
+  '#cooling-cells':
+    const: 2
+    description: |
+      Must be 2, in order to specify minimum and maximum cooling state used in
+      the cooling-maps reference. The first cell is the minimum cooling state
+      and the second cell is the maximum cooling state requested.
+
+  duration-us:
+    description: |
+      The idle duration in microsecond the device should cool down.
+
+  exit-latency-us:
+    description: |
+      The exit latency constraint in microsecond for the injected idle state 
+      for the device. It is the latency constraint to apply when selecting an 
+      idle state from among all the present ones.
 
 required:
   - '#cooling-cells'
diff --git a/dts/Bindings/thermal/thermal.txt b/dts/Bindings/thermal/thermal.txt
deleted file mode 100644
index f78bec19ca..0000000000
--- a/dts/Bindings/thermal/thermal.txt
+++ /dev/null
@@ -1,586 +0,0 @@
-* Thermal Framework Device Tree descriptor
-
-This file describes a generic binding to provide a way of
-defining hardware thermal structure using device tree.
-A thermal structure includes thermal zones and their components,
-such as trip points, polling intervals, sensors and cooling devices
-binding descriptors.
-
-The target of device tree thermal descriptors is to describe only
-the hardware thermal aspects. The thermal device tree bindings are
-not about how the system must control or which algorithm or policy
-must be taken in place.
-
-There are five types of nodes involved to describe thermal bindings:
-- thermal sensors: devices which may be used to take temperature
-  measurements.
-- cooling devices: devices which may be used to dissipate heat.
-- trip points: describe key temperatures at which cooling is recommended. The
-  set of points should be chosen based on hardware limits.
-- cooling maps: used to describe links between trip points and cooling devices;
-- thermal zones: used to describe thermal data within the hardware;
-
-The following is a description of each of these node types.
-
-* Thermal sensor devices
-
-Thermal sensor devices are nodes providing temperature sensing capabilities on
-thermal zones. Typical devices are I2C ADC converters and bandgaps. These are
-nodes providing temperature data to thermal zones. Thermal sensor devices may
-control one or more internal sensors.
-
-Required property:
-- #thermal-sensor-cells: Used to provide sensor device specific information
-  Type: unsigned	 while referring to it. Typically 0 on thermal sensor
-  Size: one cell	 nodes with only one sensor, and at least 1 on nodes
-			 with several internal sensors, in order
-			 to identify uniquely the sensor instances within
-			 the IC. See thermal zone binding for more details
-			 on how consumers refer to sensor devices.
-
-* Cooling device nodes
-
-Cooling devices are nodes providing control on power dissipation. There
-are essentially two ways to provide control on power dissipation. First
-is by means of regulating device performance, which is known as passive
-cooling. A typical passive cooling is a CPU that has dynamic voltage and
-frequency scaling (DVFS), and uses lower frequencies as cooling states.
-Second is by means of activating devices in order to remove
-the dissipated heat, which is known as active cooling, e.g. regulating
-fan speeds. In both cases, cooling devices shall have a way to determine
-the state of cooling in which the device is.
-
-Any cooling device has a range of cooling states (i.e. different levels
-of heat dissipation). For example a fan's cooling states correspond to
-the different fan speeds possible. Cooling states are referred to by
-single unsigned integers, where larger numbers mean greater heat
-dissipation. The precise set of cooling states associated with a device
-should be defined in a particular device's binding.
-For more examples of cooling devices, refer to the example sections below.
-
-Required properties:
-- #cooling-cells:	Used to provide cooling device specific information
-  Type: unsigned	while referring to it. Must be at least 2, in order
-  Size: one cell	to specify minimum and maximum cooling state used
-			in the reference. The first cell is the minimum
-			cooling state requested and the second cell is
-			the maximum cooling state requested in the reference.
-			See Cooling device maps section below for more details
-			on how consumers refer to cooling devices.
-
-* Trip points
-
-The trip node is a node to describe a point in the temperature domain
-in which the system takes an action. This node describes just the point,
-not the action.
-
-Required properties:
-- temperature:		An integer indicating the trip temperature level,
-  Type: signed		in millicelsius.
-  Size: one cell
-
-- hysteresis:		A low hysteresis value on temperature property (above).
-  Type: unsigned	This is a relative value, in millicelsius.
-  Size: one cell
-
-- type:			a string containing the trip type. Expected values are:
-	"active":	A trip point to enable active cooling
-	"passive":	A trip point to enable passive cooling
-	"hot":		A trip point to notify emergency
-	"critical":	Hardware not reliable.
-  Type: string
-
-* Cooling device maps
-
-The cooling device maps node is a node to describe how cooling devices
-get assigned to trip points of the zone. The cooling devices are expected
-to be loaded in the target system.
-
-Required properties:
-- cooling-device:	A list of phandles of cooling devices with their specifiers,
-  Type: phandle +	referring to which cooling devices are used in this
-    cooling specifier	binding. In the cooling specifier, the first cell
-			is the minimum cooling state and the second cell
-			is the maximum cooling state used in this map.
-- trip:			A phandle of a trip point node within the same thermal
-  Type: phandle of	zone.
-   trip point node
-
-Optional property:
-- contribution:		The cooling contribution to the thermal zone of the
-  Type: unsigned	referred cooling device at the referred trip point.
-  Size: one cell	The contribution is a ratio of the sum
-			of all cooling contributions within a thermal zone.
-
-Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle
-limit specifier means:
-(i)   - minimum state allowed for minimum cooling state used in the reference.
-(ii)  - maximum state allowed for maximum cooling state used in the reference.
-Refer to include/dt-bindings/thermal/thermal.h for definition of this constant.
-
-* Thermal zone nodes
-
-The thermal zone node is the node containing all the required info
-for describing a thermal zone, including its cooling device bindings. The
-thermal zone node must contain, apart from its own properties, one sub-node
-containing trip nodes and one sub-node containing all the zone cooling maps.
-
-Required properties:
-- polling-delay:	The maximum number of milliseconds to wait between polls
-  Type: unsigned	when checking this thermal zone.
-  Size: one cell
-
-- polling-delay-passive: The maximum number of milliseconds to wait
-  Type: unsigned	between polls when performing passive cooling.
-  Size: one cell
-
-- thermal-sensors:	A list of thermal sensor phandles and sensor specifier
-  Type: list of		used while monitoring the thermal zone.
-  phandles + sensor
-  specifier
-
-- trips:		A sub-node which is a container of only trip point nodes
-  Type: sub-node	required to describe the thermal zone.
-
-Optional property:
-- cooling-maps:		A sub-node which is a container of only cooling device
-  Type: sub-node	map nodes, used to describe the relation between trips
-			and cooling devices.
-
-- coefficients:		An array of integers (one signed cell) containing
-  Type: array		coefficients to compose a linear relation between
-  Elem size: one cell	the sensors listed in the thermal-sensors property.
-  Elem type: signed	Coefficients defaults to 1, in case this property
-			is not specified. A simple linear polynomial is used:
-			Z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn.
-
-			The coefficients are ordered and they match with sensors
-			by means of sensor ID. Additional coefficients are
-			interpreted as constant offset.
-
-- sustainable-power:	An estimate of the sustainable power (in mW) that the
-  Type: unsigned	thermal zone can dissipate at the desired
-  Size: one cell	control temperature.  For reference, the
-			sustainable power of a 4'' phone is typically
-			2000mW, while on a 10'' tablet is around
-			4500mW.
-
-Note: The delay properties are bound to the maximum dT/dt (temperature
-derivative over time) in two situations for a thermal zone:
-(i)  - when passive cooling is activated (polling-delay-passive); and
-(ii) - when the zone just needs to be monitored (polling-delay) or
-when active cooling is activated.
-
-The maximum dT/dt is highly bound to hardware power consumption and dissipation
-capability. The delays should be chosen to account for said max dT/dt,
-such that a device does not cross several trip boundaries unexpectedly
-between polls. Choosing the right polling delays shall avoid having the
-device in temperature ranges that may damage the silicon structures and
-reduce silicon lifetime.
-
-* The thermal-zones node
-
-The "thermal-zones" node is a container for all thermal zone nodes. It shall
-contain only sub-nodes describing thermal zones as in the section
-"Thermal zone nodes". The "thermal-zones" node appears under "/".
-
-* Examples
-
-Below are several examples on how to use thermal data descriptors
-using device tree bindings:
-
-(a) - CPU thermal zone
-
-The CPU thermal zone example below describes how to setup one thermal zone
-using one single sensor as temperature source and many cooling devices and
-power dissipation control sources.
-
-#include <dt-bindings/thermal/thermal.h>
-
-cpus {
-	/*
-	 * Here is an example of describing a cooling device for a DVFS
-	 * capable CPU. The CPU node describes its four OPPs.
-	 * The cooling states possible are 0..3, and they are
-	 * used as OPP indexes. The minimum cooling state is 0, which means
-	 * all four OPPs can be available to the system. The maximum
-	 * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V)
-	 * can be available in the system.
-	 */
-	cpu0: cpu@0 {
-		...
-		operating-points = <
-			/* kHz    uV */
-			970000  1200000
-			792000  1100000
-			396000  950000
-			198000  850000
-		>;
-		#cooling-cells = <2>; /* min followed by max */
-	};
-	...
-};
-
-&i2c1 {
-	...
-	/*
-	 * A simple fan controller which supports 10 speeds of operation
-	 * (represented as 0-9).
-	 */
-	fan0: fan@48 {
-		...
-		#cooling-cells = <2>; /* min followed by max */
-	};
-};
-
-ocp {
-	...
-	/*
-	 * A simple IC with a single bandgap temperature sensor.
-	 */
-	bandgap0: bandgap@0000ed00 {
-		...
-		#thermal-sensor-cells = <0>;
-	};
-};
-
-thermal-zones {
-	cpu_thermal: cpu-thermal {
-		polling-delay-passive = <250>; /* milliseconds */
-		polling-delay = <1000>; /* milliseconds */
-
-		thermal-sensors = <&bandgap0>;
-
-		trips {
-			cpu_alert0: cpu-alert0 {
-				temperature = <90000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "active";
-			};
-			cpu_alert1: cpu-alert1 {
-				temperature = <100000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			cpu_crit: cpu-crit {
-				temperature = <125000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "critical";
-			};
-		};
-
-		cooling-maps {
-			map0 {
-				trip = <&cpu_alert0>;
-				cooling-device = <&fan0 THERMAL_NO_LIMIT 4>;
-			};
-			map1 {
-				trip = <&cpu_alert1>;
-				cooling-device = <&fan0 5 THERMAL_NO_LIMIT>, <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
-			};
-		};
-	};
-};
-
-In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is
-used to monitor the zone 'cpu-thermal' using its sole sensor. A fan
-device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten
-different cooling states 0-9. It is used to remove the heat out of
-the thermal zone 'cpu-thermal' using its cooling states
-from its minimum to 4, when it reaches trip point 'cpu_alert0'
-at 90C, as an example of active cooling. The same cooling device is used at
-'cpu_alert1', but from 5 to its maximum state. The cpu@0 device is also
-linked to the same thermal zone, 'cpu-thermal', as a passive cooling device,
-using all its cooling states at trip point 'cpu_alert1',
-which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the
-temperature of 125C, represented by the trip point 'cpu_crit', the silicon
-is not reliable anymore.
-
-(b) - IC with several internal sensors
-
-The example below describes how to deploy several thermal zones based off a
-single sensor IC, assuming it has several internal sensors. This is a common
-case on SoC designs with several internal IPs that may need different thermal
-requirements, and thus may have their own sensor to monitor or detect internal
-hotspots in their silicon.
-
-#include <dt-bindings/thermal/thermal.h>
-
-ocp {
-	...
-	/*
-	 * A simple IC with several bandgap temperature sensors.
-	 */
-	bandgap0: bandgap@0000ed00 {
-		...
-		#thermal-sensor-cells = <1>;
-	};
-};
-
-thermal-zones {
-	cpu_thermal: cpu-thermal {
-		polling-delay-passive = <250>; /* milliseconds */
-		polling-delay = <1000>; /* milliseconds */
-
-				/* sensor       ID */
-		thermal-sensors = <&bandgap0     0>;
-
-		trips {
-			/* each zone within the SoC may have its own trips */
-			cpu_alert: cpu-alert {
-				temperature = <100000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			cpu_crit: cpu-crit {
-				temperature = <125000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "critical";
-			};
-		};
-
-		cooling-maps {
-			/* each zone within the SoC may have its own cooling */
-			...
-		};
-	};
-
-	gpu_thermal: gpu-thermal {
-		polling-delay-passive = <120>; /* milliseconds */
-		polling-delay = <1000>; /* milliseconds */
-
-				/* sensor       ID */
-		thermal-sensors = <&bandgap0     1>;
-
-		trips {
-			/* each zone within the SoC may have its own trips */
-			gpu_alert: gpu-alert {
-				temperature = <90000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			gpu_crit: gpu-crit {
-				temperature = <105000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "critical";
-			};
-		};
-
-		cooling-maps {
-			/* each zone within the SoC may have its own cooling */
-			...
-		};
-	};
-
-	dsp_thermal: dsp-thermal {
-		polling-delay-passive = <50>; /* milliseconds */
-		polling-delay = <1000>; /* milliseconds */
-
-				/* sensor       ID */
-		thermal-sensors = <&bandgap0     2>;
-
-		trips {
-			/* each zone within the SoC may have its own trips */
-			dsp_alert: dsp-alert {
-				temperature = <90000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			dsp_crit: gpu-crit {
-				temperature = <135000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "critical";
-			};
-		};
-
-		cooling-maps {
-			/* each zone within the SoC may have its own cooling */
-			...
-		};
-	};
-};
-
-In the example above, there is one bandgap IC which has the capability to
-monitor three sensors. The hardware has been designed so that sensors are
-placed on different places in the DIE to monitor different temperature
-hotspots: one for CPU thermal zone, one for GPU thermal zone and the
-other to monitor a DSP thermal zone.
-
-Thus, there is a need to assign each sensor provided by the bandgap IC
-to different thermal zones. This is achieved by means of using the
-#thermal-sensor-cells property and using the first cell of the sensor
-specifier as sensor ID. In the example, then, <bandgap 0> is used to
-monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal
-zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone
-may be uncorrelated, having its own dT/dt requirements, trips
-and cooling maps.
-
-
-(c) - Several sensors within one single thermal zone
-
-The example below illustrates how to use more than one sensor within
-one thermal zone.
-
-#include <dt-bindings/thermal/thermal.h>
-
-&i2c1 {
-	...
-	/*
-	 * A simple IC with a single temperature sensor.
-	 */
-	adc: sensor@49 {
-		...
-		#thermal-sensor-cells = <0>;
-	};
-};
-
-ocp {
-	...
-	/*
-	 * A simple IC with a single bandgap temperature sensor.
-	 */
-	bandgap0: bandgap@0000ed00 {
-		...
-		#thermal-sensor-cells = <0>;
-	};
-};
-
-thermal-zones {
-	cpu_thermal: cpu-thermal {
-		polling-delay-passive = <250>; /* milliseconds */
-		polling-delay = <1000>; /* milliseconds */
-
-		thermal-sensors = <&bandgap0>,	/* cpu */
-				  <&adc>;	/* pcb north */
-
-		/* hotspot = 100 * bandgap - 120 * adc + 484 */
-		coefficients =		<100	-120	484>;
-
-		trips {
-			...
-		};
-
-		cooling-maps {
-			...
-		};
-	};
-};
-
-In some cases, there is a need to use more than one sensor to extrapolate
-a thermal hotspot in the silicon. The above example illustrates this situation.
-For instance, it may be the case that a sensor external to CPU IP may be placed
-close to CPU hotspot and together with internal CPU sensor, it is used
-to determine the hotspot. Assuming this is the case for the above example,
-the hypothetical extrapolation rule would be:
-		hotspot = 100 * bandgap - 120 * adc + 484
-
-In other context, the same idea can be used to add fixed offset. For instance,
-consider the hotspot extrapolation rule below:
-		hotspot = 1 * adc + 6000
-
-In the above equation, the hotspot is always 6C higher than what is read
-from the ADC sensor. The binding would be then:
-        thermal-sensors =  <&adc>;
-
-		/* hotspot = 1 * adc + 6000 */
-	coefficients =		<1	6000>;
-
-(d) - Board thermal
-
-The board thermal example below illustrates how to setup one thermal zone
-with many sensors and many cooling devices.
-
-#include <dt-bindings/thermal/thermal.h>
-
-&i2c1 {
-	...
-	/*
-	 * An IC with several temperature sensor.
-	 */
-	adc_dummy: sensor@50 {
-		...
-		#thermal-sensor-cells = <1>; /* sensor internal ID */
-	};
-};
-
-thermal-zones {
-	batt-thermal {
-		polling-delay-passive = <500>; /* milliseconds */
-		polling-delay = <2500>; /* milliseconds */
-
-				/* sensor       ID */
-		thermal-sensors = <&adc_dummy     4>;
-
-		trips {
-			...
-		};
-
-		cooling-maps {
-			...
-		};
-	};
-
-	board_thermal: board-thermal {
-		polling-delay-passive = <1000>; /* milliseconds */
-		polling-delay = <2500>; /* milliseconds */
-
-				/* sensor       ID */
-		thermal-sensors = <&adc_dummy     0>, /* pcb top edge */
-				  <&adc_dummy     1>, /* lcd */
-				  <&adc_dummy     2>; /* back cover */
-		/*
-		 * An array of coefficients describing the sensor
-		 * linear relation. E.g.:
-		 * z = c1*x1 + c2*x2 + c3*x3
-		 */
-		coefficients =		<1200	-345	890>;
-
-		sustainable-power = <2500>;
-
-		trips {
-			/* Trips are based on resulting linear equation */
-			cpu_trip: cpu-trip {
-				temperature = <60000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			gpu_trip: gpu-trip {
-				temperature = <55000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			}
-			lcd_trip: lcp-trip {
-				temperature = <53000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "passive";
-			};
-			crit_trip: crit-trip {
-				temperature = <68000>; /* millicelsius */
-				hysteresis = <2000>; /* millicelsius */
-				type = "critical";
-			};
-		};
-
-		cooling-maps {
-			map0 {
-				trip = <&cpu_trip>;
-				cooling-device = <&cpu0 0 2>;
-				contribution = <55>;
-			};
-			map1 {
-				trip = <&gpu_trip>;
-				cooling-device = <&gpu0 0 2>;
-				contribution = <20>;
-			};
-			map2 {
-				trip = <&lcd_trip>;
-				cooling-device = <&lcd0 5 10>;
-				contribution = <15>;
-			};
-		};
-	};
-};
-
-The above example is a mix of previous examples, a sensor IP with several internal
-sensors used to monitor different zones, one of them is composed by several sensors and
-with different cooling devices.