diff options
Diffstat (limited to 'dts/Bindings/thermal')
| -rw-r--r-- | dts/Bindings/thermal/hisilicon-thermal.txt | 23 | ||||
| -rw-r--r-- | dts/Bindings/thermal/qcom-spmi-temp-alarm.txt | 57 | ||||
| -rw-r--r-- | dts/Bindings/thermal/thermal.txt | 9 |
3 files changed, 89 insertions, 0 deletions
diff --git a/dts/Bindings/thermal/hisilicon-thermal.txt b/dts/Bindings/thermal/hisilicon-thermal.txt new file mode 100644 index 0000000000..d48fc5280d --- /dev/null +++ b/dts/Bindings/thermal/hisilicon-thermal.txt @@ -0,0 +1,23 @@ +* Temperature Sensor on hisilicon SoCs + +** Required properties : + +- compatible: "hisilicon,tsensor". +- reg: physical base address of thermal sensor and length of memory mapped + region. +- interrupt: The interrupt number to the cpu. Defines the interrupt used + by /SOCTHERM/tsensor. +- clock-names: Input clock name, should be 'thermal_clk'. +- clocks: phandles for clock specified in "clock-names" property. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. + +Example : + + tsensor: tsensor@0,f7030700 { + compatible = "hisilicon,tsensor"; + reg = <0x0 0xf7030700 0x0 0x1000>; + interrupts = <0 7 0x4>; + clocks = <&sys_ctrl HI6220_TSENSOR_CLK>; + clock-names = "thermal_clk"; + #thermal-sensor-cells = <1>; + } diff --git a/dts/Bindings/thermal/qcom-spmi-temp-alarm.txt b/dts/Bindings/thermal/qcom-spmi-temp-alarm.txt new file mode 100644 index 0000000000..290ec06fa3 --- /dev/null +++ b/dts/Bindings/thermal/qcom-spmi-temp-alarm.txt @@ -0,0 +1,57 @@ +Qualcomm QPNP PMIC Temperature Alarm + +QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips +that utilize the Qualcomm SPMI implementation. These peripherals provide an +interrupt signal and status register to identify high PMIC die temperature. + +Required properties: +- compatible: Should contain "qcom,spmi-temp-alarm". +- reg: Specifies the SPMI address and length of the controller's + registers. +- interrupts: PMIC temperature alarm interrupt. +- #thermal-sensor-cells: Should be 0. See thermal.txt for a description. + +Optional properties: +- io-channels: Should contain IIO channel specifier for the ADC channel, + which report chip die temperature. +- io-channel-names: Should contain "thermal". + +Example: + + pm8941_temp: thermal-alarm@2400 { + compatible = "qcom,spmi-temp-alarm"; + reg = <0x2400 0x100>; + interrupts = <0 0x24 0 IRQ_TYPE_EDGE_RISING>; + #thermal-sensor-cells = <0>; + + io-channels = <&pm8941_vadc VADC_DIE_TEMP>; + io-channel-names = "thermal"; + }; + + thermal-zones { + pm8941 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&pm8941_temp>; + + trips { + passive { + temperature = <1050000>; + hysteresis = <2000>; + type = "passive"; + }; + alert { + temperature = <125000>; + hysteresis = <2000>; + type = "hot"; + }; + crit { + temperature = <145000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; + diff --git a/dts/Bindings/thermal/thermal.txt b/dts/Bindings/thermal/thermal.txt index 29fe0bfae3..8a49362dea 100644 --- a/dts/Bindings/thermal/thermal.txt +++ b/dts/Bindings/thermal/thermal.txt @@ -167,6 +167,13 @@ Optional property: by means of sensor ID. Additional coefficients are interpreted as constant offset. +- sustainable-power: An estimate of the sustainable power (in mW) that the + Type: unsigned thermal zone can dissipate at the desired + Size: one cell control temperature. For reference, the + sustainable power of a 4'' phone is typically + 2000mW, while on a 10'' tablet is around + 4500mW. + Note: The delay properties are bound to the maximum dT/dt (temperature derivative over time) in two situations for a thermal zone: (i) - when passive cooling is activated (polling-delay-passive); and @@ -546,6 +553,8 @@ thermal-zones { */ coefficients = <1200 -345 890>; + sustainable-power = <2500>; + trips { /* Trips are based on resulting linear equation */ cpu_trip: cpu-trip { |