diff options
Diffstat (limited to 'dts/Bindings/thermal')
| -rw-r--r-- | dts/Bindings/thermal/amlogic,thermal.yaml | 10 | ||||
| -rw-r--r-- | dts/Bindings/thermal/imx-thermal.txt | 61 | ||||
| -rw-r--r-- | dts/Bindings/thermal/imx-thermal.yaml | 102 | ||||
| -rw-r--r-- | dts/Bindings/thermal/imx8mm-thermal.txt | 15 | ||||
| -rw-r--r-- | dts/Bindings/thermal/imx8mm-thermal.yaml | 58 | ||||
| -rw-r--r-- | dts/Bindings/thermal/qcom-tsens.yaml | 7 | ||||
| -rw-r--r-- | dts/Bindings/thermal/rcar-gen3-thermal.txt | 60 | ||||
| -rw-r--r-- | dts/Bindings/thermal/rcar-gen3-thermal.yaml | 99 | ||||
| -rw-r--r-- | dts/Bindings/thermal/rcar-thermal.yaml | 7 | ||||
| -rw-r--r-- | dts/Bindings/thermal/socionext,uniphier-thermal.yaml | 58 | ||||
| -rw-r--r-- | dts/Bindings/thermal/sprd-thermal.yaml | 2 | ||||
| -rw-r--r-- | dts/Bindings/thermal/thermal-cooling-devices.yaml | 116 | ||||
| -rw-r--r-- | dts/Bindings/thermal/thermal-idle.yaml | 145 | ||||
| -rw-r--r-- | dts/Bindings/thermal/thermal-sensor.yaml | 72 | ||||
| -rw-r--r-- | dts/Bindings/thermal/thermal-zones.yaml | 341 | ||||
| -rw-r--r-- | dts/Bindings/thermal/ti,am654-thermal.yaml | 56 | ||||
| -rw-r--r-- | dts/Bindings/thermal/uniphier-thermal.txt | 65 |
17 files changed, 1060 insertions, 214 deletions
diff --git a/dts/Bindings/thermal/amlogic,thermal.yaml b/dts/Bindings/thermal/amlogic,thermal.yaml index e43ec50bda..999c6b365f 100644 --- a/dts/Bindings/thermal/amlogic,thermal.yaml +++ b/dts/Bindings/thermal/amlogic,thermal.yaml @@ -13,11 +13,11 @@ description: Binding for Amlogic Thermal properties: compatible: - items: - - enum: - - amlogic,g12a-cpu-thermal - - amlogic,g12a-ddr-thermal - - const: amlogic,g12a-thermal + items: + - enum: + - amlogic,g12a-cpu-thermal + - amlogic,g12a-ddr-thermal + - const: amlogic,g12a-thermal reg: maxItems: 1 diff --git a/dts/Bindings/thermal/imx-thermal.txt b/dts/Bindings/thermal/imx-thermal.txt deleted file mode 100644 index 823e4176ee..0000000000 --- a/dts/Bindings/thermal/imx-thermal.txt +++ /dev/null @@ -1,61 +0,0 @@ -* Temperature Monitor (TEMPMON) on Freescale i.MX SoCs - -Required properties: -- compatible : must be one of following: - - "fsl,imx6q-tempmon" for i.MX6Q, - - "fsl,imx6sx-tempmon" for i.MX6SX, - - "fsl,imx7d-tempmon" for i.MX7S/D. -- interrupts : the interrupt output of the controller: - i.MX6Q has one IRQ which will be triggered when temperature is higher than high threshold, - i.MX6SX and i.MX7S/D have two more IRQs than i.MX6Q, one is IRQ_LOW and the other is IRQ_PANIC, - when temperature is below than low threshold, IRQ_LOW will be triggered, when temperature - is higher than panic threshold, system will auto reboot by SRC module. -- fsl,tempmon : phandle pointer to system controller that contains TEMPMON - control registers, e.g. ANATOP on imx6q. -- nvmem-cells: A phandle to the calibration cells provided by ocotp. -- nvmem-cell-names: Should be "calib", "temp_grade". - -Deprecated properties: -- fsl,tempmon-data : phandle pointer to fuse controller that contains TEMPMON - calibration data, e.g. OCOTP on imx6q. The details about calibration data - can be found in SoC Reference Manual. - -Direct access to OCOTP via fsl,tempmon-data is incorrect on some newer chips -because it does not handle OCOTP clock requirements. - -Optional properties: -- clocks : thermal sensor's clock source. - -Example: -ocotp: ocotp@21bc000 { - #address-cells = <1>; - #size-cells = <1>; - compatible = "fsl,imx6sx-ocotp", "syscon"; - reg = <0x021bc000 0x4000>; - clocks = <&clks IMX6SX_CLK_OCOTP>; - - tempmon_calib: calib@38 { - reg = <0x38 4>; - }; - - tempmon_temp_grade: temp-grade@20 { - reg = <0x20 4>; - }; -}; - -tempmon: tempmon { - compatible = "fsl,imx6sx-tempmon", "fsl,imx6q-tempmon"; - interrupts = <GIC_SPI 49 IRQ_TYPE_LEVEL_HIGH>; - fsl,tempmon = <&anatop>; - nvmem-cells = <&tempmon_calib>, <&tempmon_temp_grade>; - nvmem-cell-names = "calib", "temp_grade"; - clocks = <&clks IMX6SX_CLK_PLL3_USB_OTG>; -}; - -Legacy method (Deprecated): -tempmon { - compatible = "fsl,imx6q-tempmon"; - fsl,tempmon = <&anatop>; - fsl,tempmon-data = <&ocotp>; - clocks = <&clks 172>; -}; diff --git a/dts/Bindings/thermal/imx-thermal.yaml b/dts/Bindings/thermal/imx-thermal.yaml new file mode 100644 index 0000000000..aedac16699 --- /dev/null +++ b/dts/Bindings/thermal/imx-thermal.yaml @@ -0,0 +1,102 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/imx-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: NXP i.MX Thermal Binding + +maintainers: + - Shawn Guo <shawn.guo@linaro.org> + - Anson Huang <Anson.Huang@nxp.com> + +properties: + compatible: + enum: + - fsl,imx6q-tempmon + - fsl,imx6sx-tempmon + - fsl,imx7d-tempmon + + interrupts: + description: | + The interrupt output of the controller, i.MX6Q has IRQ_HIGH which + will be triggered when temperature is higher than high threshold, + i.MX6SX and i.MX7S/D have two more IRQs than i.MX6Q, one is IRQ_LOW + and the other is IRQ_PANIC, when temperature is lower than low + threshold, IRQ_LOW will be triggered, when temperature is higher + than panic threshold, IRQ_PANIC will be triggered, and system can + be configured to auto reboot by SRC module for IRQ_PANIC. IRQ_HIGH, + IRQ_LOW and IRQ_PANIC share same interrupt output of controller. + maxItems: 1 + + nvmem-cells: + items: + - description: Phandle to the calibration data provided by ocotp + - description: Phandle to the temperature grade provided by ocotp + + nvmem-cell-names: + items: + - const: calib + - const: temp_grade + + fsl,tempmon: + $ref: '/schemas/types.yaml#/definitions/phandle' + description: Phandle to anatop system controller node. + + fsl,tempmon-data: + $ref: '/schemas/types.yaml#/definitions/phandle' + description: | + Deprecated property, phandle pointer to fuse controller that contains + TEMPMON calibration data, e.g. OCOTP on imx6q. The details about + calibration data can be found in SoC Reference Manual. + deprecated: true + + clocks: + maxItems: 1 + +required: + - compatible + - interrupts + - fsl,tempmon + - nvmem-cells + - nvmem-cell-names + +additionalProperties: false + +examples: + - | + #include <dt-bindings/clock/imx6sx-clock.h> + #include <dt-bindings/interrupt-controller/arm-gic.h> + + efuse@21bc000 { + #address-cells = <1>; + #size-cells = <1>; + compatible = "fsl,imx6sx-ocotp", "syscon"; + reg = <0x021bc000 0x4000>; + clocks = <&clks IMX6SX_CLK_OCOTP>; + + tempmon_calib: calib@38 { + reg = <0x38 4>; + }; + + tempmon_temp_grade: temp-grade@20 { + reg = <0x20 4>; + }; + }; + + anatop@20c8000 { + compatible = "fsl,imx6q-anatop", "syscon", "simple-mfd"; + reg = <0x020c8000 0x1000>; + interrupts = <0 49 IRQ_TYPE_LEVEL_HIGH>, + <0 54 IRQ_TYPE_LEVEL_HIGH>, + <0 127 IRQ_TYPE_LEVEL_HIGH>; + + tempmon { + compatible = "fsl,imx6sx-tempmon"; + interrupts = <GIC_SPI 49 IRQ_TYPE_LEVEL_HIGH>; + fsl,tempmon = <&anatop>; + nvmem-cells = <&tempmon_calib>, <&tempmon_temp_grade>; + nvmem-cell-names = "calib", "temp_grade"; + clocks = <&clks IMX6SX_CLK_PLL3_USB_OTG>; + }; + }; diff --git a/dts/Bindings/thermal/imx8mm-thermal.txt b/dts/Bindings/thermal/imx8mm-thermal.txt deleted file mode 100644 index 3629d3c7e7..0000000000 --- a/dts/Bindings/thermal/imx8mm-thermal.txt +++ /dev/null @@ -1,15 +0,0 @@ -* Thermal Monitoring Unit (TMU) on Freescale i.MX8MM SoC - -Required properties: -- compatible : Must be "fsl,imx8mm-tmu" or "fsl,imx8mp-tmu". -- reg : Address range of TMU registers. -- clocks : TMU's clock source. -- #thermal-sensor-cells : Should be 0 or 1. See ./thermal.txt for a description. - -Example: -tmu: tmu@30260000 { - compatible = "fsl,imx8mm-tmu"; - reg = <0x30260000 0x10000>; - clocks = <&clk IMX8MM_CLK_TMU_ROOT>; - #thermal-sensor-cells = <0>; -}; diff --git a/dts/Bindings/thermal/imx8mm-thermal.yaml b/dts/Bindings/thermal/imx8mm-thermal.yaml new file mode 100644 index 0000000000..38852877b8 --- /dev/null +++ b/dts/Bindings/thermal/imx8mm-thermal.yaml @@ -0,0 +1,58 @@ +# SPDX-License-Identifier: GPL-2.0 +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/imx8mm-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: NXP i.MX8M Mini Thermal Binding + +maintainers: + - Anson Huang <Anson.Huang@nxp.com> + +description: | + i.MX8MM has TMU IP to allow temperature measurement, there are + currently two distinct major versions of the IP that is supported + by a single driver. The IP versions are named v1 and v2, v1 is + for i.MX8MM which has ONLY 1 sensor, v2 is for i.MX8MP which has + 2 sensors. + +properties: + compatible: + enum: + - fsl,imx8mm-tmu + - fsl,imx8mp-tmu + + reg: + maxItems: 1 + + clocks: + maxItems: 1 + + "#thermal-sensor-cells": + description: | + Number of cells required to uniquely identify the thermal + sensors, 0 for ONLY one sensor and 1 for multiple sensors. + enum: + - 0 + - 1 + +required: + - compatible + - reg + - clocks + - '#thermal-sensor-cells' + +additionalProperties: false + +examples: + - | + #include <dt-bindings/clock/imx8mm-clock.h> + + thermal-sensor@30260000 { + compatible = "fsl,imx8mm-tmu"; + reg = <0x30260000 0x10000>; + clocks = <&clk IMX8MM_CLK_TMU_ROOT>; + #thermal-sensor-cells = <0>; + }; + +... diff --git a/dts/Bindings/thermal/qcom-tsens.yaml b/dts/Bindings/thermal/qcom-tsens.yaml index 2ddd39d967..d7be931b42 100644 --- a/dts/Bindings/thermal/qcom-tsens.yaml +++ b/dts/Bindings/thermal/qcom-tsens.yaml @@ -73,12 +73,11 @@ properties: - const: calib_sel "#qcom,sensors": - allOf: - - $ref: /schemas/types.yaml#/definitions/uint32 - - minimum: 1 - - maximum: 16 description: Number of sensors enabled on this platform + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 1 + maximum: 16 "#thermal-sensor-cells": const: 1 diff --git a/dts/Bindings/thermal/rcar-gen3-thermal.txt b/dts/Bindings/thermal/rcar-gen3-thermal.txt deleted file mode 100644 index 2993fa7201..0000000000 --- a/dts/Bindings/thermal/rcar-gen3-thermal.txt +++ /dev/null @@ -1,60 +0,0 @@ -* DT bindings for Renesas R-Car Gen3 Thermal Sensor driver - -On R-Car Gen3 SoCs, the thermal sensor controllers (TSC) control the thermal -sensors (THS) which are the analog circuits for measuring temperature (Tj) -inside the LSI. - -Required properties: -- compatible : "renesas,<soctype>-thermal", - Examples with soctypes are: - - "renesas,r8a774a1-thermal" (RZ/G2M) - - "renesas,r8a774b1-thermal" (RZ/G2N) - - "renesas,r8a7795-thermal" (R-Car H3) - - "renesas,r8a7796-thermal" (R-Car M3-W) - - "renesas,r8a77961-thermal" (R-Car M3-W+) - - "renesas,r8a77965-thermal" (R-Car M3-N) - - "renesas,r8a77980-thermal" (R-Car V3H) -- reg : Address ranges of the thermal registers. Each sensor - needs one address range. Sorting must be done in - increasing order according to datasheet, i.e. - TSC1, TSC2, ... -- clocks : Must contain a reference to the functional clock. -- #thermal-sensor-cells : must be <1>. - -Optional properties: - -- interrupts : interrupts routed to the TSC (must be 3). -- power-domain : Must contain a reference to the power domain. This - property is mandatory if the thermal sensor instance - is part of a controllable power domain. - -Example: - - tsc: thermal@e6198000 { - compatible = "renesas,r8a7795-thermal"; - reg = <0 0xe6198000 0 0x100>, - <0 0xe61a0000 0 0x100>, - <0 0xe61a8000 0 0x100>; - interrupts = <GIC_SPI 67 IRQ_TYPE_LEVEL_HIGH>, - <GIC_SPI 68 IRQ_TYPE_LEVEL_HIGH>, - <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>; - clocks = <&cpg CPG_MOD 522>; - power-domains = <&sysc R8A7795_PD_ALWAYS_ON>; - #thermal-sensor-cells = <1>; - }; - - thermal-zones { - sensor_thermal1: sensor-thermal1 { - polling-delay-passive = <250>; - polling-delay = <1000>; - thermal-sensors = <&tsc 0>; - - trips { - sensor1_crit: sensor1-crit { - temperature = <90000>; - hysteresis = <2000>; - type = "critical"; - }; - }; - }; - }; diff --git a/dts/Bindings/thermal/rcar-gen3-thermal.yaml b/dts/Bindings/thermal/rcar-gen3-thermal.yaml new file mode 100644 index 0000000000..b1a55ae497 --- /dev/null +++ b/dts/Bindings/thermal/rcar-gen3-thermal.yaml @@ -0,0 +1,99 @@ +# SPDX-License-Identifier: GPL-2.0-only +# Copyright (C) 2020 Renesas Electronics Corp. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/rcar-gen3-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Renesas R-Car Gen3 Thermal Sensor + +description: + On R-Car Gen3 SoCs, the thermal sensor controllers (TSC) control the thermal + sensors (THS) which are the analog circuits for measuring temperature (Tj) + inside the LSI. + +maintainers: + - Niklas Söderlund <niklas.soderlund@ragnatech.se> + +properties: + compatible: + enum: + - renesas,r8a774a1-thermal # RZ/G2M + - renesas,r8a774b1-thermal # RZ/G2N + - renesas,r8a7795-thermal # R-Car H3 + - renesas,r8a7796-thermal # R-Car M3-W + - renesas,r8a77961-thermal # R-Car M3-W+ + - renesas,r8a77965-thermal # R-Car M3-N + - renesas,r8a77980-thermal # R-Car V3H + reg: + minItems: 2 + maxItems: 3 + items: + - description: TSC1 registers + - description: TSC2 registers + - description: TSC3 registers + + interrupts: + items: + - description: TEMP1 interrupt + - description: TEMP2 interrupt + - description: TEMP3 interrupt + + clocks: + maxItems: 1 + + power-domains: + maxItems: 1 + + resets: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + +required: + - compatible + - reg + - interrupts + - clocks + - power-domains + - resets + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + #include <dt-bindings/clock/r8a7795-cpg-mssr.h> + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/power/r8a7795-sysc.h> + + tsc: thermal@e6198000 { + compatible = "renesas,r8a7795-thermal"; + reg = <0xe6198000 0x100>, + <0xe61a0000 0x100>, + <0xe61a8000 0x100>; + interrupts = <GIC_SPI 67 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 68 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&cpg CPG_MOD 522>; + power-domains = <&sysc R8A7795_PD_ALWAYS_ON>; + resets = <&cpg 522>; + #thermal-sensor-cells = <1>; + }; + + thermal-zones { + sensor_thermal: sensor-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + thermal-sensors = <&tsc 0>; + + trips { + sensor1_crit: sensor1-crit { + temperature = <90000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; diff --git a/dts/Bindings/thermal/rcar-thermal.yaml b/dts/Bindings/thermal/rcar-thermal.yaml index d2f4f1b063..0994693d24 100644 --- a/dts/Bindings/thermal/rcar-thermal.yaml +++ b/dts/Bindings/thermal/rcar-thermal.yaml @@ -20,6 +20,7 @@ properties: - const: renesas,rcar-thermal # Generic without thermal-zone - items: - enum: + - renesas,thermal-r8a7742 # RZ/G1H - renesas,thermal-r8a7743 # RZ/G1M - renesas,thermal-r8a7744 # RZ/G1N - const: renesas,rcar-gen2-thermal # Generic thermal-zone @@ -94,8 +95,8 @@ examples: thermal@e61f0000 { compatible = "renesas,thermal-r8a73a4", "renesas,rcar-thermal"; - reg = <0 0xe61f0000 0 0x14>, <0 0xe61f0100 0 0x38>, - <0 0xe61f0200 0 0x38>, <0 0xe61f0300 0 0x38>; + reg = <0xe61f0000 0x14>, <0xe61f0100 0x38>, + <0xe61f0200 0x38>, <0xe61f0300 0x38>; interrupts = <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>; clocks = <&mstp5_clks R8A73A4_CLK_THERMAL>; power-domains = <&pd_c5>; @@ -111,7 +112,7 @@ examples: compatible = "renesas,thermal-r8a7790", "renesas,rcar-gen2-thermal", "renesas,rcar-thermal"; - reg = <0 0xe61f0000 0 0x10>, <0 0xe61f0100 0 0x38>; + reg = <0xe61f0000 0x10>, <0xe61f0100 0x38>; interrupts = <GIC_SPI 69 IRQ_TYPE_LEVEL_HIGH>; clocks = <&cpg CPG_MOD 522>; power-domains = <&sysc R8A7790_PD_ALWAYS_ON>; diff --git a/dts/Bindings/thermal/socionext,uniphier-thermal.yaml b/dts/Bindings/thermal/socionext,uniphier-thermal.yaml new file mode 100644 index 0000000000..553c9dcdae --- /dev/null +++ b/dts/Bindings/thermal/socionext,uniphier-thermal.yaml @@ -0,0 +1,58 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/socionext,uniphier-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Socionext UniPhier thermal monitor + +description: | + This describes the devicetree bindings for thermal monitor supported by + PVT(Process, Voltage and Temperature) monitoring unit implemented on + Socionext UniPhier SoCs. + +maintainers: + - Kunihiko Hayashi <hayashi.kunihiko@socionext.com> + +properties: + compatible: + enum: + - socionext,uniphier-pxs2-thermal + - socionext,uniphier-ld20-thermal + - socionext,uniphier-pxs3-thermal + + interrupts: + maxItems: 1 + + "#thermal-sensor-cells": + const: 0 + + socionext,tmod-calibration: + $ref: /schemas/types.yaml#/definitions/uint32-array + maxItems: 2 + description: + A pair of calibrated values referred from PVT, in case that the values + aren't set on SoC, like a reference board. + +required: + - compatible + - interrupts + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + // The UniPhier thermal should be a subnode of a "syscon" compatible node. + + sysctrl@61840000 { + compatible = "socionext,uniphier-ld20-sysctrl", + "simple-mfd", "syscon"; + reg = <0x61840000 0x10000>; + + pvtctl: thermal { + compatible = "socionext,uniphier-ld20-thermal"; + interrupts = <0 3 1>; + #thermal-sensor-cells = <0>; + }; + }; diff --git a/dts/Bindings/thermal/sprd-thermal.yaml b/dts/Bindings/thermal/sprd-thermal.yaml index 058c4cc06b..af2ff93064 100644 --- a/dts/Bindings/thermal/sprd-thermal.yaml +++ b/dts/Bindings/thermal/sprd-thermal.yaml @@ -83,7 +83,7 @@ examples: - | ap_thm0: thermal@32200000 { compatible = "sprd,ums512-thermal"; - reg = <0 0x32200000 0 0x10000>; + reg = <0x32200000 0x10000>; clock-names = "enable"; clocks = <&aonapb_gate 32>; #thermal-sensor-cells = <1>; diff --git a/dts/Bindings/thermal/thermal-cooling-devices.yaml b/dts/Bindings/thermal/thermal-cooling-devices.yaml new file mode 100644 index 0000000000..5145883d93 --- /dev/null +++ b/dts/Bindings/thermal/thermal-cooling-devices.yaml @@ -0,0 +1,116 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal cooling device binding + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overload. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the cooling devices. + + There are essentially two ways to provide control on power dissipation: + - Passive cooling: by means of regulating device performance. A typical + passive cooling mechanism is a CPU that has dynamic voltage and frequency + scaling (DVFS), and uses lower frequencies as cooling states. + - Active cooling: by means of activating devices in order to remove the + dissipated heat, e.g. regulating fan speeds. + + Any cooling device has a range of cooling states (i.e. different levels of + heat dissipation). They also have a way to determine the state of cooling in + which the device is. For example, a fan's cooling states correspond to the + different fan speeds possible. Cooling states are referred to by single + unsigned integers, where larger numbers mean greater heat dissipation. The + precise set of cooling states associated with a device should be defined in + a particular device's binding. + +select: true + +properties: + "#cooling-cells": + description: + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + const: 2 + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/thermal/thermal.h> + + // Example 1: Cpufreq cooling device on CPU0 + cpus { + #address-cells = <2>; + #size-cells = <0>; + + CPU0: cpu@0 { + device_type = "cpu"; + compatible = "qcom,kryo385"; + reg = <0x0 0x0>; + enable-method = "psci"; + cpu-idle-states = <&LITTLE_CPU_SLEEP_0 + &LITTLE_CPU_SLEEP_1 + &CLUSTER_SLEEP_0>; + capacity-dmips-mhz = <607>; + dynamic-power-coefficient = <100>; + qcom,freq-domain = <&cpufreq_hw 0>; + #cooling-cells = <2>; + next-level-cache = <&L2_0>; + L2_0: l2-cache { + compatible = "cache"; + next-level-cache = <&L3_0>; + L3_0: l3-cache { + compatible = "cache"; + }; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + /* Corresponds to 1000MHz in OPP table */ + cooling-device = <&CPU0 5 5>; + }; + }; + }; + + /* ... */ + }; +... diff --git a/dts/Bindings/thermal/thermal-idle.yaml b/dts/Bindings/thermal/thermal-idle.yaml new file mode 100644 index 0000000000..7a922f5409 --- /dev/null +++ b/dts/Bindings/thermal/thermal-idle.yaml @@ -0,0 +1,145 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal idle cooling device binding + +maintainers: + - Daniel Lezcano <daniel.lezcano@linaro.org> + +description: | + The thermal idle cooling device allows the system to passively + mitigate the temperature on the device by injecting idle cycles, + forcing it to cool down. + + This binding describes the thermal idle node. + +properties: + $nodename: + const: thermal-idle + description: | + A thermal-idle node describes the idle cooling device properties to + cool down efficiently the attached thermal zone. + + '#cooling-cells': + const: 2 + description: | + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + + duration-us: + description: | + The idle duration in microsecond the device should cool down. + + exit-latency-us: + description: | + The exit latency constraint in microsecond for the injected + idle state for the device. It is the latency constraint to + apply when selecting an idle state from among all the present + ones. + +required: + - '#cooling-cells' + +examples: + - | + #include <dt-bindings/thermal/thermal.h> + + // Example: Combining idle cooling device on big CPUs with cpufreq cooling device + cpus { + #address-cells = <2>; + #size-cells = <0>; + + /* ... */ + + cpu_b0: cpu@100 { + device_type = "cpu"; + compatible = "arm,cortex-a72"; + reg = <0x0 0x100>; + enable-method = "psci"; + capacity-dmips-mhz = <1024>; + dynamic-power-coefficient = <436>; + #cooling-cells = <2>; /* min followed by max */ + cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>; + thermal-idle { + #cooling-cells = <2>; + duration-us = <10000>; + exit-latency-us = <500>; + }; + }; + + cpu_b1: cpu@101 { + device_type = "cpu"; + compatible = "arm,cortex-a72"; + reg = <0x0 0x101>; + enable-method = "psci"; + capacity-dmips-mhz = <1024>; + dynamic-power-coefficient = <436>; + #cooling-cells = <2>; /* min followed by max */ + cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>; + thermal-idle { + #cooling-cells = <2>; + duration-us = <10000>; + exit-latency-us = <500>; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal_zones { + cpu_thermal: cpu { + polling-delay-passive = <100>; + polling-delay = <1000>; + + /* ... */ + + trips { + cpu_alert0: cpu_alert0 { + temperature = <65000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_alert1: cpu_alert1 { + temperature = <70000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_alert2: cpu_alert2 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_crit: cpu_crit { + temperature = <95000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_alert1>; + cooling-device = <&{/cpus/cpu@100/thermal-idle} 0 15 >, + <&{/cpus/cpu@101/thermal-idle} 0 15>; + }; + + map1 { + trip = <&cpu_alert2>; + cooling-device = + <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>, + <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; + }; + }; + }; + }; diff --git a/dts/Bindings/thermal/thermal-sensor.yaml b/dts/Bindings/thermal/thermal-sensor.yaml new file mode 100644 index 0000000000..fcd25a0af3 --- /dev/null +++ b/dts/Bindings/thermal/thermal-sensor.yaml @@ -0,0 +1,72 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal sensor binding + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of thermal zones required to take appropriate + action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-sensor. + + Thermal sensor devices provide temperature sensing capabilities on thermal + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor + devices may control one or more internal sensors. + +properties: + "#thermal-sensor-cells": + description: + Used to uniquely identify a thermal sensor instance within an IC. Will be + 0 on sensor nodes with only a single sensor and at least 1 on nodes + containing several internal sensors. + enum: [0, 1] + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + }; +... diff --git a/dts/Bindings/thermal/thermal-zones.yaml b/dts/Bindings/thermal/thermal-zones.yaml new file mode 100644 index 0000000000..b8515d3eea --- /dev/null +++ b/dts/Bindings/thermal/thermal-zones.yaml @@ -0,0 +1,341 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml# +$schema: http://devicetree.org/meta-schemas/base.yaml# + +title: Thermal zone binding + +maintainers: + - Amit Kucheria <amitk@kernel.org> + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-zones. + + The polling-delay properties of a thermal-zone are bound to the maximum dT/dt + (temperature derivative over time) in two situations for a thermal zone: + 1. when passive cooling is activated (polling-delay-passive) + 2. when the zone just needs to be monitored (polling-delay) or when + active cooling is activated. + + The maximum dT/dt is highly bound to hardware power consumption and + dissipation capability. The delays should be chosen to account for said + max dT/dt, such that a device does not cross several trip boundaries + unexpectedly between polls. Choosing the right polling delays shall avoid + having the device in temperature ranges that may damage the silicon structures + and reduce silicon lifetime. + +properties: + $nodename: + const: thermal-zones + description: + A /thermal-zones node is required in order to use the thermal framework to + manage input from the various thermal zones in the system in order to + mitigate thermal overload conditions. It does not represent a real device + in the system, but acts as a container to link a thermal sensor device, + platform-data regarding temperature thresholds and the mitigation actions + to take when the temperature crosses those thresholds. + +patternProperties: + "^[a-zA-Z][a-zA-Z0-9\\-]{1,12}-thermal$": + type: object + description: + Each thermal zone node contains information about how frequently it + must be checked, the sensor responsible for reporting temperature for + this zone, one sub-node containing the various trip points for this + zone and one sub-node containing all the zone cooling-maps. + + properties: + polling-delay: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone. Setting this to 0 disables the polling + timers setup by the thermal framework and assumes that the thermal + sensors in this zone support interrupts. + + polling-delay-passive: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone while doing passive cooling. Setting + this to 0 disables the polling timers setup by the thermal + framework and assumes that the thermal sensors in this zone + support interrupts. + + thermal-sensors: + $ref: /schemas/types.yaml#/definitions/phandle-array + maxItems: 1 + description: + The thermal sensor phandle and sensor specifier used to monitor this + thermal zone. + + coefficients: + $ref: /schemas/types.yaml#/definitions/uint32-array + description: + An array of integers containing the coefficients of a linear equation + that binds all the sensors listed in this thermal zone. + + The linear equation used is as follows, + z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn + where c0, c1, .., cn are the coefficients. + + Coefficients default to 1 in case this property is not specified. The + coefficients are ordered and are matched with sensors by means of the + sensor ID. Additional coefficients are interpreted as constant offset. + + sustainable-power: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An estimate of the sustainable power (in mW) that this thermal zone + can dissipate at the desired control temperature. For reference, the + sustainable power of a 4-inch phone is typically 2000mW, while on a + 10-inch tablet is around 4500mW. + + trips: + type: object + description: + This node describes a set of points in the temperature domain at + which the thermal framework needs to take action. The actions to + be taken are defined in another node called cooling-maps. + + patternProperties: + "^[a-zA-Z][a-zA-Z0-9\\-_]{0,63}$": + type: object + + properties: + temperature: + $ref: /schemas/types.yaml#/definitions/int32 + minimum: -273000 + maximum: 200000 + description: + An integer expressing the trip temperature in millicelsius. + + hysteresis: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An unsigned integer expressing the hysteresis delta with + respect to the trip temperature property above, also in + millicelsius. Any cooling action initiated by the framework is + maintained until the temperature falls below + (trip temperature - hysteresis). This potentially prevents a + situation where the trip gets constantly triggered soon after + cooling action is removed. + + type: + $ref: /schemas/types.yaml#/definitions/string + enum: + - active # enable active cooling e.g. fans + - passive # enable passive cooling e.g. throttling cpu + - hot # send notification to driver + - critical # send notification to driver, trigger shutdown + description: | + There are four valid trip types: active, passive, hot, + critical. + + The critical trip type is used to set the maximum + temperature threshold above which the HW becomes + unstable and underlying firmware might even trigger a + reboot. Hitting the critical threshold triggers a system + shutdown. + + The hot trip type can be used to send a notification to + the thermal driver (if a .notify callback is registered). + The action to be taken is left to the driver. + + The passive trip type can be used to slow down HW e.g. run + the CPU, GPU, bus at a lower frequency. + + The active trip type can be used to control other HW to + help in cooling e.g. fans can be sped up or slowed down + + required: + - temperature + - hysteresis + - type + additionalProperties: false + + additionalProperties: false + + cooling-maps: + type: object + description: + This node describes the action to be taken when a thermal zone + crosses one of the temperature thresholds described in the trips + node. The action takes the form of a mapping relation between a + trip and the target cooling device state. + + patternProperties: + "^map[-a-zA-Z0-9]*$": + type: object + + properties: + trip: + $ref: /schemas/types.yaml#/definitions/phandle + description: + A phandle of a trip point node within this thermal zone. + + cooling-device: + $ref: /schemas/types.yaml#/definitions/phandle-array + description: + A list of cooling device phandles along with the minimum + and maximum cooling state specifiers for each cooling + device. Using the THERMAL_NO_LIMIT (-1UL) constant in the + cooling-device phandle limit specifier lets the framework + use the minimum and maximum cooling state for that cooling + device automatically. + + contribution: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + maximum: 100 + description: + The percentage contribution of the cooling devices at the + specific trip temperature referenced in this map + to this thermal zone + + required: + - trip + - cooling-device + additionalProperties: false + + required: + - polling-delay + - polling-delay-passive + - thermal-sensors + - trips + additionalProperties: false + +examples: + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/thermal/thermal.h> + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>, + <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_alert1: trip-point1 { + temperature = <95000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_crit: cpu_crit { + temperature = <110000>; + hysteresis = <1000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + /* Corresponds to 1400MHz in OPP table */ + cooling-device = <&CPU0 3 3>, <&CPU1 3 3>, + <&CPU2 3 3>, <&CPU3 3 3>; + }; + + map1 { + trip = <&cpu0_alert1>; + /* Corresponds to 1000MHz in OPP table */ + cooling-device = <&CPU0 5 5>, <&CPU1 5 5>, + <&CPU2 5 5>, <&CPU3 5 5>; + }; + }; + }; + + /* ... */ + + cluster0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 5>; + + trips { + cluster0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + cluster0_crit: cluster0_crit { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + /* ... */ + + gpu-top-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 11>; + + trips { + gpu1_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + }; + }; + }; +... diff --git a/dts/Bindings/thermal/ti,am654-thermal.yaml b/dts/Bindings/thermal/ti,am654-thermal.yaml new file mode 100644 index 0000000000..25b9209c2e --- /dev/null +++ b/dts/Bindings/thermal/ti,am654-thermal.yaml @@ -0,0 +1,56 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/ti,am654-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Texas Instruments AM654 VTM (DTS) binding + +maintainers: + - Keerthy <j-keerthy@ti.com> + +properties: + compatible: + const: ti,am654-vtm + + reg: + maxItems: 1 + + power-domains: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + +required: + - compatible + - reg + - power-domains + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + #include <dt-bindings/soc/ti,sci_pm_domain.h> + vtm: thermal@42050000 { + compatible = "ti,am654-vtm"; + reg = <0x0 0x42050000 0x0 0x25c>; + power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>; + #thermal-sensor-cells = <1>; + }; + + mpu0_thermal: mpu0_thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <500>; /* milliseconds */ + thermal-sensors = <&vtm0 0>; + + trips { + mpu0_crit: mpu0_crit { + temperature = <125000>; /* milliCelsius */ + hysteresis = <2000>; /* milliCelsius */ + type = "critical"; + }; + }; + }; +... diff --git a/dts/Bindings/thermal/uniphier-thermal.txt b/dts/Bindings/thermal/uniphier-thermal.txt deleted file mode 100644 index ceb92a9572..0000000000 --- a/dts/Bindings/thermal/uniphier-thermal.txt +++ /dev/null @@ -1,65 +0,0 @@ -* UniPhier Thermal bindings - -This describes the devicetree bindings for thermal monitor supported by -PVT(Process, Voltage and Temperature) monitoring unit implemented on Socionext -UniPhier SoCs. - -Required properties: -- compatible : - - "socionext,uniphier-pxs2-thermal" : For UniPhier PXs2 SoC - - "socionext,uniphier-ld20-thermal" : For UniPhier LD20 SoC - - "socionext,uniphier-pxs3-thermal" : For UniPhier PXs3 SoC -- interrupts : IRQ for the temperature alarm -- #thermal-sensor-cells : Should be 0. See ./thermal.txt for details. - -Optional properties: -- socionext,tmod-calibration: A pair of calibrated values referred from PVT, - in case that the values aren't set on SoC, - like a reference board. - -Example: - - sysctrl@61840000 { - compatible = "socionext,uniphier-ld20-sysctrl", - "simple-mfd", "syscon"; - reg = <0x61840000 0x10000>; - ... - pvtctl: pvtctl { - compatible = "socionext,uniphier-ld20-thermal"; - interrupts = <0 3 1>; - #thermal-sensor-cells = <0>; - }; - ... - }; - - thermal-zones { - cpu_thermal { - polling-delay-passive = <250>; /* 250ms */ - polling-delay = <1000>; /* 1000ms */ - thermal-sensors = <&pvtctl>; - - trips { - cpu_crit: cpu_crit { - temperature = <110000>; /* 110C */ - hysteresis = <2000>; - type = "critical"; - }; - cpu_alert: cpu_alert { - temperature = <100000>; /* 100C */ - hysteresis = <2000>; - type = "passive"; - }; - }; - - cooling-maps { - map0 { - trip = <&cpu_alert>; - cooling-device = <&cpu0 (-1) (-1)>; - }; - map1 { - trip = <&cpu_alert>; - cooling-device = <&cpu2 (-1) (-1)>; - }; - }; - }; - }; |