summaryrefslogtreecommitdiffstats
path: root/drivers/thermal
Commit message (Collapse)AuthorAgeFilesLines
* Merge branch 'release' of ↵Len Brown2012-10-097-123/+1937
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal Conflicts: drivers/staging/omap-thermal/omap-thermal-common. OMAP supplied dummy TC1 and TC2, at the same time that the thermal tree removed them from thermal_zone_device_register() drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c propogate the upstream MAX_IDR_LEVEL re-name to prevent a build failure Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au> Signed-off-by: Len Brown <len.brown@intel.com>
| * thermal: Exynos: Fix NULL pointer dereference in exynos_unregister_thermal()Sachin Kamat2012-09-281-2/+5
| | | | | | | | | | | | | | | | exynos_unregister_thermal() is functional only when 'th_zone' is not NULL (ensured by the NULL checks). However, in the event it is NULL, it gets dereferenced in the for loop. This patch fixes this issue. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
| * Thermal: Fix bug on cpu_cooling, cooling device's id conflict problem.Jonghwa Lee2012-09-271-2/+1
| | | | | | | | | | | | | | | | | | This patch fixes small bug on cpu_cooling. CPU cooling device has own id generated with idr mathod. However in the previous version, it swapped to all same id at last stage of probing as 0. This makes id's collision and also occures error when it releases that id. Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
| * thermal: exynos: Use devm_* functionsAmit Daniel Kachhap2012-09-241-36/+9
| | | | | | | | | | | | | | | | | | | | | | devm_* functions are used to replace kzalloc, request_mem_region, ioremap and request_irq functions in probe call. With the usage of devm_* functions explicit freeing and unmapping is not required. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Sachin Kamat <sachin.kamat@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * ARM: exynos: add thermal sensor driver platform data supportAmit Daniel Kachhap2012-09-241-1/+110
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Add necessary default platform data support needed for TMU driver. The supplied dt/non-dt values are tested for origen exynos4210 and smdk exynos5250 platforms and only compile tested for exynos4412. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: jonghwa lee <jonghwa3.lee@samsung.com> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: exynos: register the tmu sensor with the kernel thermal layerAmit Daniel Kachhap2012-09-241-2/+404
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This code added creates a link between temperature sensors, linux thermal framework and cooling devices for samsung exynos platform. This layer monitors the temperature from the sensor and informs the generic thermal layer to take the necessary cooling action. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: exynos5: add exynos5250 thermal sensor driver supportAmit Daniel Kachhap2012-09-242-128/+225
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4 changes are made generic for exynos series. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: SangWook Ju <sw.ju@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * hwmon: exynos4: move thermal sensor driver to driver/thermal directoryAmit Daniel Kachhap2012-09-243-0/+421
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: add generic cpufreq cooling implementationAmit Daniel Kachhap2012-09-243-0/+462
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: Fix potential NULL pointer accessesGuenter Roeck2012-09-241-4/+4
| | | | | | | | | | | | | | | | | | | | | | | | The type parameter in thermal_zone_device_register and thermal_cooling_device_register can be NULL, indicating that no sysfs attribute for the type should be created. Only call strlen() and strcpy() on type if it is not NULL. This patch addresses Coverity #102180 and #102182: Dereference before null check Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: add Renesas R-Car thermal sensor supportKuninori Morimoto2012-09-243-1/+270
| | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: fix potential out-of-bounds memory accessGuenter Roeck2012-09-241-2/+3
| | | | | | | | | | | | | | | | | | | | | | | | | | | | temp_crit.name and temp_input.name have a length of 16 bytes. Using THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in out-of-bounds memory accesses. Replace it with sizeof(). Addresses Coverity #115679 Signed-off-by: Guenter Roeck <linux@roeck-us.net> Cc: Len Brown <lenb@kernel.org> Cc: "Brown, Len" <len.brown@intel.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * Thermal: Introduce locking for cdev.thermal_instances list.Zhang Rui2012-09-241-0/+8
| | | | | | | | | | | | | | | | | | | | | | | | | | we need to go over all the thermal_instance list of a cooling device to decide which cooling state to put the cooling device to. But at this time, as a cooling device may be referenced in multiple thermal zones, we need to lock the list first in case another thermal zone is updating this cooling device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: Unify the code for both active and passive coolingZhang Rui2012-09-241-85/+25
| | | | | | | | | | | | | | | | | | | | Remove thermal_zone_device_passive(). And use thermal_zone_trip_update() and thermal_zone_do_update() for both active and passive cooling. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: Introduce simple arbitrator for setting device cooling stateZhang Rui2012-09-241-3/+41
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This fixes the problem that a cooling device may be referenced by by multiple trip points in multiple thermal zones. With this patch, we have two stages for updating a thermal zone, 1. check if a thermal_instance needs to be updated or not 2. update the cooling device, based on the target cooling state of all its instances. Note that, currently, the cooling device is set to the deepest cooling state required. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: List thermal_instance in thermal_cooling_device.Zhang Rui2012-09-241-1/+6
| | | | | | | | | | | | | | | | | | | | List thermal_instance in thermal_cooling_device so that cooling device can know the cooling state requirement of all the thermal instances. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: Rename thermal_instance.node to thermal_instance.tz_node.Zhang Rui2012-09-241-10/+10
| | | | | | | | | | | | | | | | | | | | | | | | thermal_instance should be referenced by both thermal zone devices and thermal cooling devices. Rename thermal_instance.node to thermal_instance.tz_node in this patch and thermal_instanace.cdev_node will be introduced in next patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: Rename thermal_zone_device.cooling_devicesZhang Rui2012-09-241-9/+9
| | | | | | | | | | | | | | | | | | | | | | | | Rename thermal_zone_device.cooling_devices to thermal_zone_device.thermal_instances thermal_zone_device.cooling_devices is not accurate as this is a list for thermal instances, rather than cooling devices. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: rename structure thermal_cooling_device_instance to thermal_instanceZhang Rui2012-09-241-9/+9
| | | | | | | | | | | | | | | | | | | | | | | | This struct is used to describe the behavior for a thermal cooling device on a certain trip point for a certain thremal zone. thermal_cooling_device_instance is not accurate, as a cooling device can be used for more than one trip point in one thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: Introduce thermal_zone_trip_update()Zhang Rui2012-09-241-26/+76
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This function is used to update the cooling state of all the cooling devices that are bound to an active trip point. This will be used for passive cooling as well, in the future patches. as both active and passive cooling can share the same algorithm, which is 1. if the temperature is higher than a trip point, a. if the trend is THERMAL_TREND_RAISING, use higher cooling state for this trip point b. if the trend is THERMAL_TREND_DROPPING, use lower cooling state for this trip point 2. if the temperature is lower than a trip point, use lower cooling state for this trip point. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: Remove tc1/tc2 in generic thermal layer.Zhang Rui2012-09-242-19/+7
| | | | | | | | | | | | | | | | | | Remove tc1/tc2 in generic thermal layer. .get_trend() callback starts to take effect from this patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
| * Thermal: Introduce .get_trend() callback.Zhang Rui2012-09-241-2/+17
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | According to ACPI spec, tc1 and tc2 are used by OSPM to anticipate the temperature trends. We introduced the same concept to the generic thermal layer for passive cooling, but now it seems that these values are hard to be used on other platforms. So We introduce .get_trend() as a more general solution. For the platform thermal drivers that have their own way to anticipate the temperature trends, they should provide their own .get_trend() callback. Or else, we will calculate the temperature trends by simply comparing the current temperature and the cached previous temperature reading. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
| * Thermal: set upper and lower limitsZhang Rui2012-09-241-7/+16
| | | | | | | | | | | | | | | | | | set upper and lower limits when binding a thermal cooling device to a thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: Introduce cooling states range supportZhang Rui2012-09-241-4/+21
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | As the active cooling devices can have multiple cooling states, we may want only several cooling states for a certain trip point, and other cooling states for other active trip points. To do this, we should be able to describe the cooling device behavior for a certain trip point, rather than for the entire thermal zone. And when updating thermal zone, we need to check the upper and lower limit to make sure the cooling device is set to the proper cooling state. Note that this patch will not bring any different behavior as upper limit is set to max_state and lower limit is set to 0 in this patch, for now. Next patch will set these to real values. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
| * Thermal: Introduce multiple cooling states supportZhang Rui2012-09-241-2/+10
| | | | | | | | | | | | | | | | | | This is because general active cooling devices, like fans, may have multiple speeds, which can be mapped to different cooling states. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
* | idr: rename MAX_LEVEL to MAX_IDR_LEVELFengguang Wu2012-10-061-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | To avoid name conflicts: drivers/video/riva/fbdev.c:281:9: sparse: preprocessor token MAX_LEVEL redefined While at it, also make the other names more consistent and add parentheses. [akpm@linux-foundation.org: repair fallout] [sfr@canb.auug.org.au: IB/mlx4: fix for MAX_ID_MASK to MAX_IDR_MASK name change] Signed-off-by: Fengguang Wu <fengguang.wu@intel.com> Cc: Bernd Petrovitsch <bernd@petrovitsch.priv.at> Cc: walter harms <wharms@bfs.de> Cc: Glauber Costa <glommer@parallels.com> Signed-off-by: Stephen Rothwell <sfr@canb.auug.org.au> Cc: Roland Dreier <roland@purestorage.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
* | workqueue: use mod_delayed_work() instead of cancel + queueTejun Heo2012-08-131-9/+6
|/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Convert delayed_work users doing cancel_delayed_work() followed by queue_delayed_work() to mod_delayed_work(). Most conversions are straight-forward. Ones worth mentioning are, * drivers/edac/edac_mc.c: edac_mc_workq_setup() converted to always use mod_delayed_work() and cancel loop in edac_mc_reset_delay_period() is dropped. * drivers/platform/x86/thinkpad_acpi.c: No need to remember whether watchdog is active or not. @fan_watchdog_active and related code dropped. * drivers/power/charger-manager.c: Seemingly a lot of delayed_work_pending() abuse going on here. [delayed_]work_pending() are unsynchronized and racy when used like this. I converted one instance in fullbatt_handler(). Please conver the rest so that it invokes workqueue APIs for the intended target state rather than trying to game work item pending state transitions. e.g. if timer should be modified - call mod_delayed_work(), canceled - call cancel_delayed_work[_sync](). * drivers/thermal/thermal_sys.c: thermal_zone_device_set_polling() simplified. Note that round_jiffies() calls in this function are meaningless. round_jiffies() work on absolute jiffies not delta delay used by delayed_work. v2: Tomi pointed out that __cancel_delayed_work() users can't be safely converted to mod_delayed_work(). They could be calling it from irq context and if that happens while delayed_work_timer_fn() is running, it could deadlock. __cancel_delayed_work() users are dropped. Signed-off-by: Tejun Heo <tj@kernel.org> Acked-by: Henrique de Moraes Holschuh <hmh@hmh.eng.br> Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Acked-by: Anton Vorontsov <cbouatmailru@gmail.com> Acked-by: David Howells <dhowells@redhat.com> Cc: Tomi Valkeinen <tomi.valkeinen@ti.com> Cc: Jens Axboe <axboe@kernel.dk> Cc: Jiri Kosina <jkosina@suse.cz> Cc: Doug Thompson <dougthompson@xmission.com> Cc: David Airlie <airlied@linux.ie> Cc: Roland Dreier <roland@kernel.org> Cc: "John W. Linville" <linville@tuxdriver.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Len Brown <len.brown@intel.com> Cc: "J. Bruce Fields" <bfields@fieldses.org> Cc: Johannes Berg <johannes@sipsolutions.net>
* Merge tag 'for-v3.6' of git://git.infradead.org/battery-2.6Linus Torvalds2012-07-311-1/+1
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Pull battery updates from Anton Vorontsov: "The tag contains just a few battery-related changes for v3.6. It's is all pretty straightforward, except one thing. One of our patches added thermal support for power supply class, but thermal/ subsystem changed under our feet. We (well, Stephen, that is) caught the issue and it was decided[1] that I'd just delay the battery pull request, and then will fix it up by merging upstream back into battery tree at the specific commit. That's not all though: another[2] small fixup for thermal subsystem was needed to get rid of a warning in power supply subsystem (the warning was not drivers/power's "fault", the thermal registration function just needed a proper const annotation, which is also done by a small commit on top of the merge. So, to sum this up: - The 'master' branch of the battery tree was in the -next tree for weeks, was never rebased, altered etc. It should be all OK; - Although, for-v3.6 tag contains the 'master' branch + merge + the warning fix. [1] http://lkml.org/lkml/2012/6/19/23 [2] http://lkml.org/lkml/2012/6/18/28" * tag 'for-v3.6' of git://git.infradead.org/battery-2.6: (23 commits) thermal: Constify 'type' argument for the registration routine olpc-battery: update CHARGE_FULL_DESIGN property for BYD LiFe batteries olpc-battery: Add VOLTAGE_MAX_DESIGN property charger-manager: Fix build break related to EXTCON lp8727_charger: Move header file into platform_data directory power_supply: Add min/max alert properties for CAPACITY, TEMP, TEMP_AMBIENT bq27x00_battery: Add support for BQ27425 chip charger-manager: Set current limit of regulator for over current protection charger-manager: Use EXTCON Subsystem to detect charger cables for charging test_power: Add VOLTAGE_NOW and BATTERY_TEMP properties test_power: Add support for USB AC source gpio-charger: Use cansleep version of gpio_set_value bq27x00_battery: Add support for power average and health properties sbs-battery: Don't trigger false supply_changed event twl4030_charger: Allow charger to control the regulator that feeds it twl4030_charger: Add backup-battery charging twl4030_charger: Fix some typos max17042_battery: Support CHARGE_COUNTER power supply attribute smb347-charger: Add constant charge and current properties power_supply: Add constant charge_current and charge_voltage properties ...
| * thermal: Constify 'type' argument for the registration routineAnton Vorontsov2012-07-311-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | thermal_zone_device_register() does not modify 'type' argument, so it is safe to declare it as const. Otherwise, if we pass a const string, we are getting the ugly warning: CC drivers/power/power_supply_core.o drivers/power/power_supply_core.c: In function 'psy_register_thermal': drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default] include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *' Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org> Acked-by: Jean Delvare <khali@linux-fr.org>
| |
| \
*-. \ Merge branches 'acpi_pad', 'acpica', 'apei-bugzilla-43282', 'battery', ↵Len Brown2012-07-263-55/+197
|\ \ \ | | | | | | | | | | | | 'cpuidle-coupled', 'cpuidle-tweaks', 'intel_idle-ivb', 'ost', 'red-hat-bz-772730', 'thermal', 'thermal-spear' and 'turbostat-v2' into release
| | * | drivers/thermal/spear_thermal.c: add Device Tree probing capabilityViresh Kumar2012-06-022-10/+17
| |/ / |/| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | SPEAr platforms now support DT and so must convert all drivers to support DT. This patch adds DT probing support for SPEAr thermal sensor driver and updates its documentation too. Also, as SPEAr is the only user of this driver and is only available with DT, make this an only DT driver. So, platform_data is completely removed and passed via DT now. Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Cc: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
| * | Thermal: Add Hysteresis attributesDurgadoss R2012-07-241-5/+83
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | The Linux Thermal Framework does not support hysteresis attributes. Most thermal sensors, today, have a hysteresis value associated with trip points. This patch adds hysteresis attributes on a per-trip-point basis, to the Thermal Framework. These attributes are optionally writable. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
| * Thermal: Make Thermal trip points writeableDurgadoss R2012-07-242-45/+102
|/ | | | | | | | | | | | Some of the thermal drivers using the Generic Thermal Framework require (all/some) trip points to be writeable. This patch makes the trip point temperatures writeable on a per-trip point basis, and modifies the required function call in thermal.c. This patch also updates the Documentation to reflect the new change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: Fix for setting the thermal zone mode to enable/disableAmit Daniel Kachhap2012-03-221-2/+2
| | | | | | | | | Basically without this patch changing the mode of thermal zone is not possible as wrong string size is passed to strncmp. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: spear13xx: checking for NULL instead of IS_ERR()Dan Carpenter2012-03-221-2/+2
| | | | | | | | | | | thermal_zone_device_register() never returns NULL, on error it returns and ERR_PTR(). Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com> Reviewed-by: Viresh Kumar <viresh.kumar@st.com> Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal/spear_thermal: replace readl/writel with lighter _relaxed variantsViresh Kumar2012-03-221-8/+8
| | | | | | | | | | readl/writel versions for ARM contain memory barrier instruction for synchronizing DMA buffers. These are not required at least on this module. So use lighter _relaxed variants. Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: add support for thermal sensor present on SPEAr13xx machinesVincenzo Frascino2012-03-223-0/+215
| | | | | | | | | | | | | | | | | ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal_sys: convert printks to pr_<level>Joe Perches2012-03-221-8/+6
| | | | | | | | | | | | | Use the current logging style. Remove PREFIX, add pr_fmt, convert the printks. All dmesg output now prefixed with "thermal_sys: ". Signed-off-by: Joe Perches <joe@perches.com> Cc: Jesper Juhl <jj@chaosbits.net> Cc: Len Brown <lenb@kernel.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal_sys: kernel style cleanupsJoe Perches2012-03-221-17/+13
| | | | | | | | | | | | Just a few tidies to make it more like most kernel sources. A couple of long lines still remain. Signed-off-by: Joe Perches <joe@perches.com> Reviewed-by: Jesper Juhl <jj@chaosbits.net> Cc: Len Brown <lenb@kernel.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal_sys: remove obfuscating used-once macrosJoe Perches2012-03-221-20/+12
| | | | | | | | | | | These don't add any value as they are used only once and the surrounding code uses similar variable. Signed-off-by: Joe Perches <joe@perches.com> Cc: Jesper Juhl <jj@chaosbits.net> Cc: Len Brown <lenb@kernel.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal_sys: remove unnecessary line continuationsJoe Perches2012-03-221-6/+5
| | | | | | | | | | | Line continations are not necessary in function calls or statements. Remove them. Signed-off-by: Joe Perches <joe@perches.com> Reviewed-by: Jesper Juhl <jj@chaosbits.net> Cc: Len Brown <lenb@kernel.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* drivers/thermal/thermal_sys.c: fix build warningFabio Estevam2012-03-221-2/+1
| | | | | | | | | | | | | | | | With CONFIG_NET=n: drivers/thermal/thermal_sys.c:63: warning: 'thermal_event_seqnum' defined but not used Move 'thermal_event_seqnum' definition inside the '#ifdef CONFIG_NET' [akpm@linux-foundation.org: make thermal_event_seqnum local to generate_netlink_event()] Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Acked-by: Durgadoss R <durgadoss.r@intel.com> Cc: Jean Delvare <khali@linux-fr.org> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: Rename generate_netlink_eventJean Delvare2012-01-231-2/+2
| | | | | | | | | | | | It doesn't seem right for the thermal subsystem to export a symbol named generate_netlink_event. This function is thermal-specific and its name should reflect that fact. Rename it to thermal_generate_netlink_event. Signed-off-by: Jean Delvare <khali@linux-fr.org> Acked-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: R.Durgadoss <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: Prevent polling from happening during system suspendRafael J. Wysocki2011-11-061-2/+2
| | | | | | | | | | The thermal driver should use a freezable workqueue to schedule polling to prevent thermal_zone_device_update() from being run during system suspend, when the devices it relies on may be inactive. Make it use the system freezable workqueue for this purpose. Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: make THERMAL_HWMON implementation fully internalJean Delvare2011-08-021-25/+92
| | | | | | | | | | | | | | | | | | | | | | | | | | THERMAL_HWMON is implemented inside the thermal_sys driver and has no effect on drivers implementing thermal zones, so they shouldn't see anything related to it in <linux/thermal.h>. Making the THERMAL_HWMON implementation fully internal has two advantages beyond the cleaner design: * This avoids rebuilding all thermal drivers if the THERMAL_HWMON implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or disabled. * This avoids breaking the thermal kABI in these cases too, which should make distributions happy. The only drawback I can see is slightly higher memory fragmentation, as the number of kzalloc() calls will increase by one per thermal zone. But I doubt it will be a problem in practice, as I've never seen a system with more than two thermal zones. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: split hwmon lookup to a separate functionJean Delvare2011-08-021-6/+19
| | | | | | | | | | We'll soon need to reuse it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: hide CONFIG_THERMAL_HWMONJean Delvare2011-08-021-6/+2
| | | | | | | | | | | | | | | It's about time to revert 16d752397301b9 ("thermal: Create CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also be running a recent enough version of lm-sensors. Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of dropping it, we keep it but hide it. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* ACPI:Fix goto flows in thermal-sysDurgadoss R2011-03-231-6/+7
| | | | | | | | | | This patch fixes two minor bugs in thermal_sys: (a) The flow of goto's in thermal_hwmon_add_sysfs. (b) Remove the temp*_crit only if there is a get_crit_temp defined, in thermal_remove_hwmon_sysfs. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* ACPI: Fix build for CONFIG_NET unsetRafael J. Wysocki2011-02-282-20/+21
| | | | | | | | | | | | | | | | | | | | | Several ACPI drivers fail to build if CONFIG_NET is unset, because they refer to things depending on CONFIG_THERMAL that in turn depends on CONFIG_NET. However, CONFIG_THERMAL doesn't really need to depend on CONFIG_NET, because the only part of it requiring CONFIG_NET is the netlink interface in thermal_sys.c. Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET and remove the dependency of CONFIG_THERMAL on CONFIG_NET from drivers/thermal/Kconfig. Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: Randy Dunlap <randy.dunlap@oracle.com> Cc: Ingo Molnar <mingo@elte.hu> Cc: Len Brown <lenb@kernel.org> Cc: Stephen Rothwell <sfr@canb.auug.org.au> Cc: Luming Yu <luming.yu@intel.com> Cc: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
* Merge branch 'misc' into releaseLen Brown2011-01-121-12/+5
|\
generated by cgit v1.2.3 (git 2.39.1) at 2024-05-26 00:39:35 +0000